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FLY-801 T Top LED Wire bonder

FeaturesParameters

Features

- Thermosonic high speed bonding, fast conversion

- Vision system: Programmable look ahead PR

- Multiple die and level bonding capability

- Ease of maintenance

- Competitive pricing

 

Wire type

Au, Ag, Cu, CuPd, alloy


Application

LED industry


Item

Parameter

Bonding   Technology

Thermosonic   bonding

Optics

Single Path

Bonding Accuracy

±3.0μm

Bond area

56 x 70mm

Cycle time

65ms/wire

Wire diameter

18μm-50μm


Links

粵ICP備05019798號 Copyright © 2021 KEJIE TECHNOLOGY CO.,LTD. All rights reserved.  

粵公網(wǎng)安備 44070302000690號

400-889-8833

Sale@kejiegroup.com

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