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FLY-801 TO Laser Diode Wire bonder

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FeaturesParameters

Features

- Thermosonic high speed bonding, fast conversion

- Vision system: Programmable look ahead PR

- Multiple die and level bonding capability

- Rotating platform

- Bonding on crossed planes at any angle

Wire type

Applied Range

Optical communications

Item	Parameter
Bonding Technology	Thermosonic bonding
Optics	Single path or double paths (optional)
Bonding Accuracy	±3.0μm
Bonding area	56 x 70mm
Cycle time	Parallel planes: 60ms/wire Crossed planes: 80ms/wire
Wire diameter	17μm-50μm